The company’s main business is the research and development, design and sales of MOSFET, IGBT and other semiconductor chips and power devices. The products sold by the company can be divided into chips and packaged products according to whether they are packaged or not. The company is a professional vertical sub-factory. The chip is designed by the company and then handed over to the chip foundry for OEM production. The packaged products are entrusted by the company to entrust an external packaging and testing company to package and test the chip.

The company is a leading enterprise in the design of semiconductor power devices such as MOSFETs in China. The company has established Jiangsu Power Device Engineering Technology Research Center, Jiangsu Enterprise Graduate Workstation, Southeast University-Wuxi New Clean Energy Power Device Technology Joint R&D Center, and Jiangnan University-Wuxi New Clean Energy Power Device Technology Joint Research and Development Center. The “Key Technology and Application of Intelligent Power Driver Chip Design and Preparation” project participated by the company won the first prize of Jiangsu Province Science and Technology Award in 2019, and won the 2020 National Technology Invention Award. Up to now, the company has 135 patents, including 36 invention patents; at the same time, the company has participated in the publication of 13 papers in IEEE, TDMR and other internationally renowned journals, of which 7 papers are included in SCI. In June 2021, the company was listed in the “Forbes 2021 China’s Most Innovative Enterprise List TOP50”

Wuxi Dianji Integrated Technology Co., Ltd. is located at No. 6 Dianteng Road, Xinwu District, Wuxi City. It was established on March 21, 2017 and is a wholly-owned subsidiary of Wuxi New Clean Energy Co., Ltd. The company has a registered capital of 270 million yuan, covers an area of 15,272 square meters, and has a construction area of 21,467 square meters. At present, the packaging and testing workshop covers an area of 8,000 square meters. The main packaging forms are SOT, TO series, and DFN product packaging. The company focuses on the packaging and testing of high-performance, high-reliability power semiconductor discrete devices and multi-chip power management devices. Its main business is the design, manufacture and sales of power electronic components, integrated circuits and semiconductor module products. The company has the current world advanced level of semiconductor device packaging and testing production lines. The main equipment is all imported from the United States, Japan, Singapore and other countries. The high degree of automation ensures the stability of products and provides a solid foundation for modern production.